Two-step process for forming cured polymeric films for electronic device encapsulation
US10533104B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jul 31, 2018 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/28
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for increasing the degree of curing and/or reducing the volatile photoinitiator concentration in cured polymeric film, and particularly in cured polymeric films in a multilayered thin film encapsulation stack are provided. Also provided are highly crosslinked and/or low-outgassing thin polymeric films and encapsulation stacks made using the methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.