Methods and apparatuses for selective chemical etching
US10533134B2 · kind B2 · utility
0Cited by
4References
11Claims
0Family size
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Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Oct 21, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods, apparatuses and systems are disclosed for chemically etching parts by generating an enclosed chemical etching chamber in contact with a part surface and directing a flow of chemical etchant solution in contact with a part region to be etched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.