Airflow sensor assembly for monitored heat exchanger system
US10533881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2017 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24F2110/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A sensor assembly that includes a mounting frame; and a support platform coupled with the mounting frame. The support platform has a top platform surface with a circuit board disposed thereon. The circuit board is operably configured with a secondary microcontroller and a Hall effect sensor. There is an inner sensor housing configured to extend out and around the circuit board and the support platform. There is a first magnet coupled to an underside of the inner sensor housing. There is a rotating member configured with a plurality of blades and a rotating member mounting ring, the rotating member is proximately disposed on top of the inner sensor housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.