Module board coupling
US10534138B2 · kind B2 · utility
3Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.