Metal smart card with dual interface capability
US10534990B2 · kind B2 · utility
9Cited by
6References
65Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2019 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Mar 28, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07773
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.