Substrate-treating apparatus and method for treating a substrate using the same
US10535510B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2015 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Jun 10, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate-treating apparatus includes a liquid-providing part, a first liquid-removing knife and a returning part. The liquid-providing part provides a first liquid chemical for cleaning a substrate that includes a metal pattern and a photoresist pattern on the metal pattern, and for removing an etchant that remains on the substrate. The first liquid-removing knife sprays a second liquid chemical in a direction inclined and opposite to a returning direction of the substrate, so as to remove the first liquid chemical, the first liquid chemical including a metal precipitate. The returning part returns the substrate from the liquid-providing part toward the first liquid-removing knife in the returning direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.