Micro device arrangement in donor substrate
US10535546B2 · kind B2 · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2017 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Jan 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with unwanted pads and the non-interfering area in the donor substrate is maximized. This enables to have transfer the devices to receiver substrate with fewer steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.