Package structure and method for forming the same

US10535609B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Yi-Da Tsai · Dingshanjiao, TW
• Cheng Ping Lin · Daxi District, TW
• Wei-Hung Lin · Xinfeng, TW
• Chih-Wei Lin · Hsinchu, TW
• Ming-Da Cheng · Zhubei City, TW
• Ching-Hua Hsieh · Hsinchu, TW
• Chung-Shi Liu · Baoshan, TW

Key dates

• Filing date: Jun 27, 2018
• Grant date: Jan 14, 2020
• Expiry date: Jun 27, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Package structures and methods for forming the same are provided. A package structure includes a package layer. The package structure also includes an integrated circuit die and a first connector embedded in the package layer. The package structure further includes a redistribution layer over the package layer. The integrated circuit die is electrically connected to the redistribution layer through the first connector. In addition, the package structure includes a passivation layer over the redistribution layer. The package structure also includes a second connector over the passivation layer. A first portion of the redistribution layer and a second portion of the second connector extend into the passivation layer. The second portion of the second connector has a tapered profile along a direction from the integrated circuit die towards the first connector.