Patent · US Active

One-dimensional metallization for solar cells

US10535790B2 · kind B2 · utility

2Cited by
2References
15Claims
0Family size

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Key dates

Filing dateJun 25, 2015
Grant dateJan 14, 2020
Priority date
Expiry dateJun 25, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/547

Abstract

Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.