Method for manufacturing light emitting device using a releasable base material
US10535794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2017 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Dec 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a light emitting device includes placing a light emitting element on a releasable base material so that a first face of the light emitting element is in contact with the releasable base material. An entire area of the first face is a first area. A wavelength converting material is provided on the releasable base material to cover an entirety of the light emitting element. The releasable base material is removed. A first electrically conductive material covers the first electrode and the wavelength converting material. An entire area of the first electrically conductive material viewed in a height direction is a second area larger than the first area. A second electrically conductive material covers the second electrode and the wavelength converting material. An entire area of the second electrically conductive material viewed in the height direction is a third area larger than the first area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.