Multi-state packages
US10536138B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2018 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Sep 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K5/2472
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In examples, an integrated circuit package comprises a pin exposed externally to the package; at least one resistor coupled to the pin at a first end of the resistor; a first transistor coupled to the at least one resistor at a second end of the resistor and coupled to a voltage source; a second transistor coupled to the at least one resistor at the second end of the resistor and coupled to a ground connection, the at least one resistor and the first and second transistors couple at a first node, the first and second transistors are of different types; and multiple comparators, each of the multiple comparators coupled to a voltage divider network and to the pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.