Semiconductor device
US10537018B2 · kind B2 · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 24, 2019 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Apr 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One semiconductor device includes a wiring substrate, a first semiconductor chip that is mounted on one surface of the wiring substrate, a second semiconductor chip that is laminated on the first semiconductor chip so as to form exposed surfaces where the surface of the first semiconductor chip is partially exposed, silicon substrates that are mounted on the exposed surfaces and serve as warping control members, and an encapsulation body that is formed on the wiring substrate so as to cover the first semiconductor chip, the second semiconductor chip and the silicon substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.