Patent · US Active

Deterministic assembly of complex, three-dimensional architectures by compressive buckling

US10538028B2 · kind B2 · utility

11Cited by
37References
64Claims
0Family size

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Key dates

Filing dateNov 17, 2015
Grant dateJan 21, 2020
Priority date
Expiry dateNov 8, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K1/0283
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Origami- and Kirigami-inspired assembly of predetermined three-dimensional forms is presented in comprehensive theoretical and experimental studies, with examples of a broad range of topologies and material compositions. The resulting engineering options in the construction of functional 3D structures have important implications for advanced microsystem technologies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.