Method for cutting glass using a laser, and glass produced according to the method
US10538453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2017 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Nov 17, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C3/093
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for cutting thin glass, wherein the thin glass is heated with a laser beam along a path forming a cutting line moving along a forward feed direction, such that a crack propagates along the cutting line and cuts through the thin glass. The laser beam is formed by a beam-forming optic in such a way that the beam profile thereof has an elongated shape. The laser beam is orientated on the surface of the thin glass such that the longitudinal direction thereof is aligned in the feed direction. The elongated shape of the beam profile is asymmetric, such that the intensity course differs at the ends of the beam profile in such a way that the increase in intensity at the front end crossing the thin glass first is steeper than the drop in intensity at the opposite rear end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.