Patent · US Active

Method for cutting glass using a laser, and glass produced according to the method

US10538453B2 · kind B2 · utility

0Cited by
3References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 10, 2017
Grant dateJan 21, 2020
Priority date
Expiry dateNov 17, 2037

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC03C3/093
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method for cutting thin glass, wherein the thin glass is heated with a laser beam along a path forming a cutting line moving along a forward feed direction, such that a crack propagates along the cutting line and cuts through the thin glass. The laser beam is formed by a beam-forming optic in such a way that the beam profile thereof has an elongated shape. The laser beam is orientated on the surface of the thin glass such that the longitudinal direction thereof is aligned in the feed direction. The elongated shape of the beam profile is asymmetric, such that the intensity course differs at the ends of the beam profile in such a way that the increase in intensity at the front end crossing the thin glass first is steeper than the drop in intensity at the opposite rear end.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.