Patent · US Active

Electrolytic copper plating bath compositions and a method for their use

US10538850B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Heiko Brunner · Berlin, DE
Dirk Rohde · Berlin, DE
Manuel Pölleth · Berlin, DE
Sven Rückbrod · Berlin, DE
Desthree Darwin · Berlin, DE
Sandra Niemann · Berlin, DE
Gerhard Steinberger · Berlin, DE

Key dates

Filing date	Apr 20, 2016
Grant date	Jan 21, 2020
Priority date	—
Expiry date	Dec 8, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D21/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.