System and method for multi-frequency downhole bus communication
US10539013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2017 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Jun 26, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/18
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A bottom hole assembly includes a single wire bus, a legacy sensor coupled to the single wire bus, and at least one high frequency communication sensor coupled to the single wire bus. The high frequency communication sensor injects a high frequency signal alternating between high frequency synchronization pulses and high frequency data signals onto the single wire bus. A first high frequency pass filter coupled between the at least one high frequency communication sensor and the single wire bus is also included. The high frequency pass filter passes the high frequency signal to the single wire bus from the high frequency communication sensor. The bottom hole assembly includes a first high frequency blocking filter coupled between the legacy sensor and the single wire bus. The high frequency blocking filter blocks the high frequency signal from the high frequency communication sensor from disturbing a legacy signal at the legacy sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.