Fiber attach assembly and test automation
US10539743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2016 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Jun 9, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3652
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.