Compressing data points into polygons
US10540785B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2018 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2210/56
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for compressing three-dimensional data points is disclosed. The method includes measuring a plurality of three-dimensional data points using one or more sensors communicatively coupled to the computing device, where each three-dimensional data point represents a point in a three-dimensional environment. The method also includes dividing the three-dimensional environment into a plurality of spatial cubes, wherein each three-dimensional data point is mapped to one spatial cube. The method also includes, for each spatial cube, converting the three-dimensional data points in the respective spatial cube to a two-dimensional plane based on a number of three-dimensional data points in the respective spatial cube. The method also includes, for each two-dimensional plane, determining polygon vertices of a planar polygon at points where an edge of an associated spatial cube intersects the respective two-dimensional plane. The method also includes sending the polygon vertices of each planar polygon to a ground station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.