Label assembly
US10540914B2 · kind B2 · utility
0Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2016 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Jul 7, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F2003/0282
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates generally to methods and system for creating a multiple part peel and reseal label assembly that may include one or more RFID devices for use in providing information to potential end users. The assembly may be provided with a plurality of informational sheets or layers that may be printed with fixed or variable information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.