Method and device for evaluating quality of thin film layer
US10541178B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jun 28, 2017 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Nov 24, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of evaluating the quality of a thin film layer may include: forming the thin film layer on a substrate; applying a stress to the thin film layer; and evaluating the quality of the thin film layer. A device for evaluating the quality of the thin film layer may include a stress chamber for applying a stress to the thin film layer and a refractive index measuring unit for evaluating the quality of the thin film layer based on a rate of change of a refractive index.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.