Semiconductor package including organic interposer
US10541187B2 · kind B2 · utility
1Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2018 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Apr 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.