Package structure of capacitive coupling isolator
US10541195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2018 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/0266
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.