Electronic device having electromagnetic interference shielding layer and method of manufacturing the same
US10541210B2 · kind B2 · utility
2Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2018 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Dec 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.