Interconnection including a cable assembly and a board assembly, a board assembly for an interconnection and a method for making an interconnection

US10541479B2 · kind B2 · utility

Assignee

• MD ELEKTRONIK GMBH · DE

Inventors

• Martin Huber · Uttenreuth, DE
• Robert Hofmann · Berlin, DE

Key dates

• Filing date: Jul 9, 2018
• Grant date: Jan 21, 2020
• Expiry date: Jul 9, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/0475
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

An interconnection includes a cable assembly and a board assembly. The cable assembly includes a cable having an inner conductor. The board assembly comprises an intermediate layer disposed between first and second outer layers, a recess disposed between the first and second outer layers so as to form a cable-receiving space at a first side edge, and a first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space. The inner conductor is inserted at the first side edge into the cable-receiving space and is disposed at an offset in a longitudinal direction relative to the first inner-conductor contact opening. The inner conductor is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of the first and/or second outer layers, at least in a region of the first inner-conductor contact opening.