Surface acoustic wave (SAW) resonator having trap-rich region
US10541667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2016 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Aug 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6483
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave (SAW) resonator device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate comprises a bulk region, and a surface region. The surface region has a high trap density, and a reduced carrier mobility, compared to the bulk region. A piezoelectric layer, having a first surface and a second surface, is disposed over the semiconductor substrate. A plurality of electrodes are disposed over the first surface of the piezoelectric layer, and the plurality of electrodes are configured to generate surface acoustic waves in the piezoelectric layer. The SAW resonator device also comprises a layer disposed between the first surface of the semiconductor substrate and the second surface of the piezoelectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.