Case with multi-layer encapsulation of design elements
US10541714B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2018 |
| Grant date | Jan 21, 2020 |
| Priority date | — |
| Expiry date | Sep 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/185
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A case with multi-layer encapsulation of design elements. The case generally comprises a shell including a back panel which incorporates design elements encapsulated in a plurality of layers. Each layer comprises a different design element or a different configuration of design elements. And a method of encapsulation of two or more layers of design elements into a product, including the steps of mixing decorative design elements with a liquid epoxy monomer to form a mixture; adding a hardening agent or catalyst to the mixture; pouring the mixture into a cavity on a case or cover; allowing the mixture to harden to form a cured first layer; applying another layer of epoxy over the cured first layer; arranging decorative design elements onto the uncured layer of epoxy; applying another layer of epoxy over the decorative design elements, and allowing that layer to cure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.