Device modified substrate article and methods for making
US10543662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2015 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Apr 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02079
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.