Separating film and method
US10543670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2014 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jan 12, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/40
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A separating film with an anti-adhesion layer for preventing an adhesive connection between a thermally curable levelling compound, applied in the region of a joining zone of a first component, and a joining zone of a second component to be joined to the first component. The anti-adhesion layer is provided, at least in parts, with a heating layer. As a result of the actively electrically heatable heating layer of the separating film, which is an integral part of the separating film, the processing time for joining two components, which are subject to tolerances, using a thermally curable levelling compound (known as liquid shimming), can be reduced by at least 40% compared with the conventional process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.