Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment
US10544040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2018 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | May 30, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/035
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.