Composition for the production of polyimide film for flexible board of photoelectronic device
US10544266B2 · kind B2 · utility
3Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2016 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.