Polyamide moulding composition and moulded article made from this moulding composition
US10544286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2015 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jun 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/26
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention refers to a polyamide moulding composition consisting of the following components: a) 45 to 75% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 18 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines and cycloaliphatic diamines, b) 5 to 20% by weight of at least one fibrous reinforcing agent, c) 10 to 40% by weight of at least one non-sized filler which is different from the fibrous reinforcing agent in b), d) 0 to 10% by weight of a at least one additive, with the proviso that the component b) and c) add up to 25 to 45% by weight and the entirety of components a) to d) add up to 100% by weight. Moreover, the present invention refers to a moulded article producible from this moulding composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.