Patent · US Active

Covering materials for adhesive hot-melt glues

US10544295B2 · kind B2 · utility

1Cited by

9References

6Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Marcus Heemann · Goldkronach, DE
Sebastian Kostyra · Monheim, DE
Eckhard Puerkner · Dressendorf, DE
Gerald Petry · Hückelhoven, DE
Riju Davis · Schwabmünchen, DE

Key dates

Filing date	Sep 12, 2017
Grant date	Jan 28, 2020
Priority date	—
Expiry date	Mar 9, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2314/06
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ≤1000 and ≥300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.