Thermoformable conductive inks and coatings and a process for fabrication of a thermoformed device
US10544317B2 · kind B2 · utility
1Cited by
7References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2015 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Thermoformable inks and coatings, such as conductive inks and coatings, are provided. These inks and coatings can be used in printed electronic thermoformed devices. These conductive inks and coatings are suitable to be used as one or more printed layers of a printed electronic device printed with multiple layers of inks and/or coatings (printed stacked array). Methods of fabricating printed electronic devices using the thermoformable inks and coatings are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.