Slurry composition and method of use
US10544332B2 · kind B2 · utility
0Cited by
18References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2016 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Sep 7, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry composition for use in chemical-mechanical polishing sapphire substrates and includes an alkaline pH adjuster and an accelerant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.