Microseismic event localization using both direct-path and head-wave arrivals
US10545250B2 · kind B2 · utility
1Cited by
1References
9Claims
0Family size
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Key dates
| Filing date | Nov 10, 2014 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Oct 4, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V2210/612
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to methods and apparatuses for using head waves to greatly improve microseismic event localization accuracy, particularly in the depth dimension, by analyzing them in addition to direct path arrivals whenever they are observed. Embodiments of the invention also include techniques known as multipath analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.