Overlay compensation method and system thereof

US10545402B2 · kind B2 · utility

Assignees

• Semiconductor Manufacturing International (Shanghai) Corporation · CN
• Semiconductor Manufacturing International (Beijing) Corporation · CN

Inventors

• Lingyi Guo · Shanghai, CN
• Yi Lin · San Jose, US

Key dates

• Filing date: Sep 4, 2018
• Grant date: Jan 28, 2020
• Expiry date: Sep 4, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70633
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An overlay compensation method and a related system are presented. The method includes: acquiring a first offset vector reflecting the relative position between overlay marks of a middle and a bottom target layers; acquiring a second offset vector reflecting the relative position between the overlay marks of a top and the middle target layers; decomposing the first offset vector into a first compensable component and a first uncompensable component; decomposing the second offset vector into a second compensable component and a second uncompensable component; computing minimum values of the first uncompensable component and the second uncompensable component; computing optimized values for the first compensable component and the second compensable component; and computing a third compensable component of a third offset vector reflecting the relative position between the overlay marks of the top and the bottom target layers.