Power plane shape optimization within a circuit board
US10546089B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2018 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Fabrication of a circuit board is facilitated by automatically determining an optimized power plane shape for a power plane of the circuit board, including ascertaining for the power plane a source location(s) and a sink location(s), where the source supplies power to the sink across the power plane. A center of current density is determined for the power plane shape, and a respective power plane sub-shape is incrementally generated between the center of current density and each source and sink location to, in part, supply a desired operational voltage from the source location(s) to the sink location(s) across the power plane. The respective power plane sub-shapes are combined into the optimized power plane shape. Further, the process includes initiating fabricating of the circuit board using, at least in part, the optimized power plane shape to provide the power plane shape within the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.