Mapped meshing method and mapped seeding method
US10546420B1 · kind B1 · utility
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22Claims
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Key dates
| Filing date | May 2, 2013 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Jul 30, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T17/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for mesh generation for a model are disclosed. A mesh generation system may include a processing circuit configured to receive a surface geometry of a model, the surface geometry including more than one boundary node. The processing circuit is further configured to generate a finite element mesh of the model using the one or more boundary nodes of the surface geometry. The generation of the finite element mesh occurs via one of a mapped meshing method and a mapped seeding method. The mapped seeding method may be used when one or more fixed nodes are present in the model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.