Resin composition for high dielectric constant materials, molded article containing same, and master batch for coloring
US10546665B2 · kind B2 · utility
1Cited by
4References
11Claims
0Family size
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Key dates
| Filing date | Feb 6, 2014 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Feb 6, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This resin composition for high dielectric constant materials contains 40-80% by mass of (A) a resin material and 20-60% by mass of (B) a carbon black. The carbon black (B) has a DBP absorption of 10-50 mL/100 g and an iodine adsorption of 5-40 mg/g. This resin composition for high dielectric constant materials has a dielectric constant of 4 or more and a dielectric loss tangent of 0.05 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.