Backplane structure and process for microdriver and micro LED
US10546796B2 · kind B2 · utility
4Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2017 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Feb 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.