Heat transfer structure and manufacturing method therefore
US10546797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2016 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Aug 6, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P20/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are (i) a heat transport structure which is excellent in heat transfer efficiency and (ii) a method of producing such a heat transport structure. The heat transport structure in accordance with an embodiment of the present invention includes: a first thermally conductive material in which through holes are formed; and second thermally conductive materials which are fitted in the respective through holes in a perpendicular direction which is a direction perpendicular to a surface direction, a thermal conductivity which the first thermally conductive material exhibits in the surface direction being higher than a thermal conductivity which the first thermally conductive material exhibits in the perpendicular direction, each of the second thermally conductive materials being held by an inner surface of a corresponding one of the through holes and having fitting strength of not less than 0.5 N/mm per unit circumference of the corresponding one of the through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.