Patent · US Active

Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material

US10546823B2 · kind B2 · utility

0Cited by

1References

13Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Balu Pathangey · Scottsdale, US
Mihir A. Oka · Chandler, US
Andrew Proctor · Duvall, US

Key dates

Filing date	Nov 13, 2015
Grant date	Jan 28, 2020
Priority date	—
Expiry date	Nov 13, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3512
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.