Antenna Module
US10547119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2018 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | May 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/243
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.