Base material for printed interconnect boards and manufacturing method of printed interconnect boards
US10548217B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Jan 28, 2020 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.