Patent · US Active

Method for producing a foil arrangement and corresponding foil arrangement

US10548229B2 · kind B2 · utility

0Cited by

9References

7Claims

0Family size

Assignee

Conti Temic microelectronic GmbH · DE

Inventors

Johannes Bock · Kirchensittenbach, DE
Andreas Rebelein · Nuremberg, DE
Andreas Schulze · Aesch, CH
Andreas Voegerl · Parsberg, DE

Key dates

Filing date	May 27, 2015
Grant date	Jan 28, 2020
Priority date	—
Expiry date	May 27, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12438
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.