Edge field imprint lithography
US10549313B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2016 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Dec 9, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for an imprint lithography method of edge field patterning, the method including providing a template having a mold, the mold having a patterning surface comprising patterned features; providing a substrate having an edge step layer positioned thereon the edge step layer including a sloped profile; depositing a polymerizable material on the edge step layer of the substrate; contacting the polymerizable material at one or more of a plurality of edge fields located at a perimeter of the substrate with the mold of the template; and based on the contacting, forming a pattern based on the patterned features at the one or more edge fields to provide an edge field pattern, wherein contact between the template and the substrate proximate to the plurality of edge fields is prevented based on the edge step layer of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.