Liquid composition
US10549344B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jul 7, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2304/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 μm˜30 μm which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150° C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (Ω/□).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.