Thinwall composites for electronic enclosures and other devices
US10549512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2015 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Aug 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an embodiment, an A-B-A structure, can comprise: a core layer comprising a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness and wherein the core layer comprise at least one of (i) a through plane thermal conductivity of greater than equal to 0.1 W/m K, and (ii) a core layer density (X) that is X≥0.8Y; a first outer layer comprising a second thermoplastic material located on a first side of the core layer; and a second outer layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core thickness is 30% to 75% of a total thickness of the A-B-A structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.