Polyamides based on aminoalkylpiperazine or aminoarylpiperazine for hot-melt adhesives
US10550227B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2015 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Jun 22, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J179/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A semi-crystalline polyamide including at least one monomer resulting from the condensation of a diacid and of a diamine of formula AP.Y, the semi-crystalline polyamide having the following general formula (I): AP.Y/(A)m/(Pip.Y′)n/(B.Y″)q and the semi-crystalline polyamide having an Mp1 less than or equal to approximately 150° C., in particular less than or equal to approximately 130° C., in particular less than or equal to approximately 120° C. and/or a Tg less than or equal to approximately 60° C., in particular less than or equal to approximately 50° C., in particular less than or equal to approximately 40° C., as determined respectively by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.