Method for insulating sub-soil
US10550538B2 · kind B2 · utility
0Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2015 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | May 15, 2035 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE02D2300/0046
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
This invention relates to a method for insulating sub-soil comprising mechanically destructuring the sub-soil, injecting an insulating material into the destructured sub-soil, and mixing the sub-soil and the insulating material. The thermal conductivity of the insulating material is strictly lower than the thermal conductivity of the sub-soil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.